Reliability Test Systems
MIRA- Package & wafer-level Multi-Application testingThe MIRA modular system allows for a wide variety of configurations to meet testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system
ACE - Package level pulse EM and BTS testingEM or BTS Full AC Version: Electromigration and TDDB / BTS effects on semiconductor devices used under AC conditions have typically been approximated using \"corrected\" results from DC testing. However, the ever-increasing miniaturization of components and the need to question the traditional DC to AC correction factors has produced a growing demand for advanced testing tools and techniques that more closely simulate \"real-world\" degradation of devices used under AC conditions. To meet this demand, QualiTau has developed two full AC versions of the ACE for either pulsed electromigration or pulsed TDDB / BTS testing.
Infinity - Package & wafer-level TDDB & HC testingQualiTau's Infinity testing system has a flexible modular architecture that enables easy upgrading from a few package or die test system to a high capacity test system and is available for package or wafer level testing.
The system can have up to 16 Source & Measurement Unit (SMU) cards and each SMU has up to 24 voltage sources for a total of 384 sources. A wide variety of SMU options are available to fit your requirements.
Multi-Site Parallel Wafer-Level Probing SystemThe QualiTau Multi-Site Probe system is not just a probe card, but a complete probing solution testing 10s to 100s of DUTs simultaneously. It includes the probe station, anti-vibration table, light tight enclosure, digital camera with high powered optics, optional vacuum hot chuck, multiple-pin mini-probe cards, and QualiTau's patented technique of placing multiple probe cards across the surface of a wafer. This technique provides the positioners with multi-dimensional alignment control including global X, Y, Z and Theta adjustment on the chuck, X and Y adjustments on the rails, and X, Y, Z and Theta fine adjustments on each positioner head.