 |
TDDB Graph Click to enlarge
|
|
| |
 |
 |
|
 Electromigration
TDDB
Hot Carrier
Temperature environment
Additional benefits
|
|
| |
 |
QualiTau TDDB modules are offered in three optional capacities: 30, 60 and 90 sources with the option of either 36 Volt or 60 Volt stressing capability with up to 10 mA of current. Each TDDB module can perform in any stress mode for Constant Voltage, Ramped Voltage, Constant Current, and Ramped Current type tests.
Expanded or Standard mode: Each TDDB module can be configured for Expanded or Standard modes. Expanded mode (for voltage type tests) allows each source to stress up to three capacitors in parallel in each package. This mode is a cost-effective way of utilizing the sources and oven space to triple the system's capacity. Standard mode is required for Current type tests and is optional for voltage type tests when customers require the system to perform in non-stop stress mode.
SILC: As oxides have become thinner, the definition of failure has changed. No longer is catastrophic failure of the oxide the determining factor in lifetime calculations. For thinner oxides, the criterion is now Stress Induced Leakage Currents (SILC). SILC testing is now a standard feature in the TDDB software. Please see the QualiTau Tech Note titled "TDDB Stress Induced Leakage Current (SILC) Testing" for more details.
|
|
|
