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Electromigration Modules: QualiTau offers a variety of Electromigration modules to meet your testing requirements. The modules range from having 6 to 60 sources with maximum currents ranging from 2.5 mA to 1 Amp, maximum voltages ranging from 9 Volts to 110 Volts, and current resolution as low as 0.13 A. Every QualiTau Electromigration module has a true current source dedicated for each DUT. Single density or double density options: All EM modules can be provided with ovens in a Single Density or Double Density configuration. Single Density means there is one DUT per socket on the DUT board. Double Density means there are two DUTs per socket, which allows for a cost effective solution that better utilizes the space within each oven. Automatic Joule Heating or Temperature Coefficient of Resistance (TCR) determination: While the ovens are ramping up to stress temperature, the EM modules and software automatically determine the Joule Heating effect independently for each DUT. Please see the QualiTau Tech Note titled .Joule Heating During Electromigration Tests. for more details. Extrusion monitors: The EM modules allow for two extrusion monitors per device. The system is able to monitor very small leakage currents between two adjacent metal lines. This allows the system to not only look for the traditional failure mode of metal extruding and shorting to the adjacent line, but also to evaluate the integrity of barrier materials in keeping metals, especially copper, out of the inter-level dielectric. Since extrusion monitoring is performed by multiplexing a voltage on the extrusion line only when monitoring the leakage current, there is very little stress on the dielectric during testing. Contact Electromigration: Most Electromigration modules have both high and low voltage supplies. The low voltage supply is essential for Contact Electromigration to avoid a breakdown of the reverse biased junction. Please see the QualiTau Tech Note titled "Contact Electromigration" for more details. Also, please see the QualiTau Tech Note titled "Electromigration Test Methodology: Failure Criteria, Test Time and Other Related Issues" for more details about Electromigration testing. |
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