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The MIRA modular system allows for a wide variety of configurations to meet testing requirements for EM, Contact EM, Stress Migration, TDDB, QBD, ILD, BTS, SILC, HC, NBTI, AC HC, and Bipolar HC. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe. The following modules and options are available for the MIRA system:


  Electromigration       TDDB       Hot Carrier   Temperature environment       Additional benefits

MIRA modular system